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Test wafers for packaging

12" molding(epoxy) grind and polishing

8" wafer Cu patterns for probe card

  1. 8" Silicon wafer
  2. patterning resist patterns
  3. Ti/Cu plating
  4. resist removal

TSV patterned test wafer

  1. 8" Si wafer dry etching: >40um hole
  2. Ti sputtering and Cu plating
  3. Cu polishing
  4. Resist stripping

Micro-Cu pillar

  1. Ti/Cu PVD sputtering
  2. Resist patterning
  3. Cu/Ni/Sn plating
  4. Resist stripping