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Si wafer grinding and polishing

Precision grinder (~300mm)
Precision grinder (~300mm)
  1. Backgrind or double sided grind of Si wafer: Min thickness to <150um, Ra 0.02um, TTV ~1um
  2. Will need specific diamond wheel for eficiency and surface finishes.
Speefam 36GPAW CMP machine
Speefam 36GPAW CMP machine
  1. Works size: 100mm~300mm
  2. thickness: >100um
  3. surface finishes roughness Ra: <1nm

Laser interferometer (TTV & thickness) 

  1. noncontact measurement
  2. precision 0.1um
  3. warpage/bow measurment

Ultrasonic cleaner

  1. scrubber 
  2. heated tank solvent
  3. DI water rinse

Visual inspection

  1. various brightness
  2. AOI inspecition(TBD)