Qz and Ceramics Substrates
Qz、AlN、Al2O3(sapphire)、LTN/LTO、SiC etc.
CNC shaping
- edge groud/Notch: ~300mm
- edge polish: Ra 0.02um
- bubble、warpage、TTV screening
substrate grinding(thinning)
- Max size: ~300mm
- Min thickness: <150um
- Ra as request
surface roughness(Ra)
- wheel grade vs damage layer
- hardness vs feedin speed
- wheel type vs wear rate
ultrasonic clearner
Hot alkaline acid and DI rinse
Flatness/TTV measurement
6" 700um SiC grind and polish
4"(100mm) 100/150/200um Al2O3 wafers Product name
Molding epoxy grinding 12" wafer
150mm(6") TTV real data: 1um achieved