Products iso9001:2015 certificated

Glass Wafers and Substrates 

1. size: 4"~12"(wafer) 9"(substrate)
   
2. Glass materials: specific  CTE (coefficient of expansion) such as non alkaline glass, soda lime, borofloat BF33 and D263 glasses, and Boro-aluminum glass.
3. Works: CNC shaping、grind thinning、polishing、laser marking、cleaning、inspection
4. thickness: 0.3~1.1 mm or substrate to ~2.0mm。

Silicon wafer grinding/polishing

1. size: 6-12" (wafer)
2. applications: 3D TSV wafers, polishing carriers, back-grind of power device wafers etc.
3. works: grind thinning、polishing、laser mark、clean、inspection
4. thickness: 100um~1mm
5. precision: w-to-w TTV 5um, the best 1um。
6. spec:  <2um defect and Ra <1.0nm。
   

Quartz、Ceramics substrate

1. size: 4"~12" (wafer), 9"(228.6x228.6 plate)
   
2. materials: synthesis quartz、Al2N3、Al2O3、SiC、LTN/LTO etc..
3. Works: CNC shaping、grind tinning、polishing、laser marking
4. Applications: mask, LED/PCB substrate for thermal dissipation, Optical lens etc..

Masks and Patterned Optics

1. Quartz and soalime (4"~700x800 mm)
   
2. AF coating: (5"~700x800mm)
3. Min CD >=2um+/-0.1um(Qz)
4. laser cutting and edge grind
5. applications: mask for LCD, LED, Package 1X reticle and aligner，vernier、test mask etc..

Test wafers for advanced package

1. 8" wafer and Cu pattern CD 10um.
2. TGV or TSV: hole size >40um diameter, Cu film plating and grind/polishing
3. Thickness reduction polishing, micro drilling, copper electroplating, copper film grinding and polishing, etc.

Ebeam resist (all resist)

1. resolution 10nm ，low exposure dose，high etching selectivity。
2. Mix and match: ZEP 520， and perform better than Fuji 171. NEB 22 resist.
3. Mix and match to EUV resist.
4. low COO and early deliver even small volume。