About us iso9001:2015 certificated
Chen-lin Technology was established in March 2015 and is positioned to process various optical glass, silicon, quartz and ceramic wafers or substrates with high flatness. As well as providing photomasks and vertically integrated patterned test wafers. The main core competencies are:
- Thinning and polishing of substrate thickness: Below 12" (300mm), the thickness is reduced to 50um, and the flatness of the substrate is TTV<3um. Polished to mirror surface. Surface roughness to 0.5nm.
- Various glass, ceramic, quartz substrates and processing: including quartz wire cutting, CNC shaping and edging, grinding and thinning, lens cutting after coating.
- Provides mask fabrication, patterned optics, patterned test wafers.
We provides technology integration research and development services. Successful cases include: patterned test wafer (test wafer for probe card), Cu and epoxy CMP, SiC grinding and polishing, Micro-Cu pillar through hole for packaging Glass (TGV) and so on.
