Chen-Lin Technology Co., Ltd
Provide thinning, grinding and polishing services for glass, silicon, ceramic wafers or substrates, and integrate coating, mask and patterning to provide test wafers and optical components. Welcome to cooperate in the development of products that require pattern integration.
Provide you with various optical substrates such as glass, silicon, ceramics, quartz, etc., especially SiC grinding and polishing. In addition, recently, the pin-to-pin spacing of advanced packaging test cards has reached less than 70um, and the test wafer to verify the position of the test card pins has become a necessary fixture for self-calibration. Our company can provide test wafers, integrating silicon or glass thickness to metal coating patterning; also can provide light correction components from optical materials to patterns. Products offered are:
Respect customers, satisfy customers, and establish and link cross-industry supply chains.
