封裝用測試晶圓
12" molding(epoxy) grind and polishing
Package molding epoxy grinding of 12" Si wafer
Micro-Cu pillar appeal after molding compound polishing, 50um Cu pillar
8" wafer Cu patterns for probe card
- 8" Silicon wafer
- patterning resist patterns
- Ti/Cu plating
- resist removal
TSV patterned test wafer
- 8" Si wafer dry etching: >40um hole
- Ti sputtering and Cu plating
- Cu polishing
- Resist stripping
Micro-Cu pillar
- Ti/Cu PVD sputtering
- Resist patterning
- Cu/Ni/Sn plating
- Resist stripping